A multitasking laser processing machine of excimer/femtosecond laser has been newly introduced in FUTA-Q. The excimer laser system can perform multiple micro fabrications simultaneously with the laser beam going through a mask. In this machine, the excimer and femtosecond laser processing can be overlapped consecutively on the same workpiece.

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This issue introduces the case study that challenges the limits of “small-diameter deep hole drilling” which can be utilized in machining processes for variety of parts. Our deepest record in machining a small-diameter hole of Φ0.5 mm was about 13.5 mm. This time, we have succeeded in machining a deep hole with a depth of 40 mm.

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Ultrafine-diameter tapered wires are used in medical equipment for endovascular treatment. The wire shape desired by a customer can be obtained by designing a combination of forward and reverse tapers to match the size and rigidity of the functional components to be assembled, which can improve the operability of the final product.

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This issue introduces parts the size of a water flea or a grain of rice, and micro composite components comprising these parts. Examples of observation of various surface conditions obtained by changing processing conditions are also introduces.

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Ultrashort pulse laser processing machines (femtosecond and picosecond lasers) can process various kinds of material to make fine grooves, holes, and embossed/debossed shapes on them by the precisely controlled focal point of the laser beam and the orientation of the material.

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This issue introduces the process for small-diameter pipes and wires with ultrashort pulse laser processing machines such as picosecond or femtosecond lasers to make micro shapes and fine patterns on the pipes/wires while minimizing the thermal effect on the materials.

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